Electrolytic copper foil is copper clad laminate (CCL) and printed circuit board (PCB) manufacturing of important materials, in today’s electronic information industry high-speed development, electrolytic copper foil is called electronic product signals and power transmission, communication “neural network.”Electronic grade copper foil, more than 99.7% purity, thickness 5um-105um, is one of the basic materials of the electronics industry.
Electrolytic copper foil is used as raw material for electrolytic cu or wire scrap with the same purity as electrolytic copper, dissolving it in sulfuric acid, making copper sulfate solution, taking metal drum as cathode, electrolytic deposition of metal copper on the surface of cathode drum by electrolytic reaction, and making raw foil continuously from the cathode drum, then after pickling, coarsening, curing , plated brass after the process of processing finished products.Its production process includes two processes, electrolysis and electroplating.
There are two kinds of DSA anode structure in the raw foil machine:
2.FIP: A titanium Strip with a star-shaped hole on the titanium support body or a TI plate with a titanium bolt on the back (thickness of 5mm or 6mm).
Easy to provide the above titanium anode production and repair coating.